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Composed material studies with microwave simulation methods

机译:用微波仿真方法组成材料研究

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This article is a study of composed materials, specific to multilayered PCBs, in particular of the multilayered structure: conducting path - dielectric layer - conducting plane. These dielectric-conductor structures have been studied with microwave simulation methods, in the frequency range 1-10GHz, using a specific simulation program, HFFS. The electrical permittivities were obtained for electric field orientation parallel and transverse to the main geometrical axis. The geometry and composition influence on the electrical properties of the material were studied. The geometrical and physical resonances are found and the possibilities of avoiding them by controlling the macroscopic material structure are discussed. The frequency dependence of the permittivities shows that, the greater the frequency field, the smaller is the substance's response to the external field. This study continues our previous work, already published in two articles in national revues.
机译:本文是对组合材料的研究,特定于多层PCB,特别是多层结构:导电路径介电层导电平面。已经使用微波仿真方法,在1-10GHz中使用微波仿真方法研究了这些介质导体结构,使用特定的仿真程序HFF。获得电磁场取向的电允许,并平行和横向于主要几何轴线。研究了几何形状和组成对材料电性能的影响。发现了几何和物理谐振,并讨论了通过控制宏观材料结构来避免它们的可能性。允许性的频率依赖性表明,频率场越大,物质对外部场的响应越小。本研究继续我们以前的工作,已经在国家报册的两个文章中发表。

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