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Atomic oxygen characterisation in a RIE O2/Ar discharge using Laser-Induced Fluorescence and Mass Spectrometry

机译:使用激光诱导的荧光和质谱法在RIE O2 / Ar放电中的原子氧表征

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Reported on here are absolute atomic oxygen density variations with various plasma control parameters such as RF power and gas pressure using two-photon absorption laser induced fluorescence (TALIF) and mass spectrometry. These diagnostics provide a benchmark measurement to validate radical density estimation using OES (Actinometry) which in some cases prove be an unreliable measurement due to imprecise rate constants and misinterpretation of spectral emission lines. In IC manufacturing, process variation is largely related to the control of the oxygen radical density which can drift due to a change in wall condition or wafer loading affects. The results discussed in this work focus on identifying and monitoring such process variation in conjunction with real time control strategies with a view to improve the repeatability of industrial plasma processes.
机译:这里报道的是绝对原子氧密度变化,具有各种等离子体控制参数,例如使用双光子吸收激光诱导荧光(TALIF)和质谱法的RF功率和气体压力。这些诊断提供了基准测量,以使用OES(散曲线)验证自由基密度估计,这在某些情况下由于不精确的速率常数和光谱排放线的误解而被证明是不可靠的测量。在IC制造中,过程变化主要与控制氧自由基密度的控制有关,其由于墙壁状况或晶圆负载影响的变化而漂移。这项工作讨论的结果侧重于识别和监测与实时控制策略相结合的这种过程变化,以提高工业等离子体过程的可重复性。

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