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Influence of bonding thickness on stability of integrated circuits at effect of electromagnetic fields

机译:粘合厚度对电磁场效果稳定性的影响

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摘要

The technique of numerical calculation of stability integrated circuits is adduced depending on thickness (depth) of bonding at effect of pulse electromagnetic fields. The data on influencing depth of inhomogeneous bonding on threshold values of an electric field strength of a dropping electromagnetic wave are obtained.
机译:稳定性集成电路的数值计算技术是根据脉冲电磁场​​施加粘接的厚度(深度)而引入的。获得关于影响滴电磁波电场强度的阈值的影响的影响深度的数据。

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