The topic of the paper is analysis of the process of cure of epoxy resins. Cure is a thermally driven process in which an initially liquid mixture of monomers is transformed to a solid polymeric glass. Dielectric signals from the curing resin can be used to follow the progress of cure. In this study equivalent circuit analysis has been used to model the dielectric signal. The dielectric signal comprises contributions from different phenomena, such as dipolar relaxation or ionic conductivity. The identification of the areas where each phenomenon dominates the signal is important, as it is usually the case that just one phenoenon will be related to the optimisation target. In this work a computer code based on genetic algorithms was implemented and applied to data obtained for a commercial epoxy resin system. The model parameters were quantified and the process areas where the signal could be attributed to a single phenomenon were identified.
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