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New Micro Probe for Dimensional Metrology based on a Silicon Microstructure

机译:基于硅组织的尺寸计量新微探头

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Further miniaturization and modularization are current trends in micro- and nanotechnology that require precision 3D-coordinate measurements. Probing ball diameters in the range of some 100 μm and probing forces in the mN down to the μN range are required. Conventional coordinate measuring machines (CCM) do not supply such small probing balls and moreover their measurement uncertainties of about 1 μm are not sufficient for many applications. A key topic in this context are probing tools for this new generation of high precision CCM's because they -as first part in the measuring chain- directly influence the accuracy of the total system. Therefore in the past years some new approaches have been made to develop and realize a new generation of probing tools for high precision CCM's using micro technology fabrication methods (1). These activities are based on a three axial tactile force sensor concept which showed to be capable to be used as micro probe (1).
机译:进一步的小型化和模块化是需要精密3D坐标测量的微型和纳米技术的当前趋势。需要探测球直径,并且需要将MN中的MN中的探测力下降到μN范围的范围内。传统的坐标测量机(CCM)不提供这种小探测球,而且它们的测量不确定性约为1μm的许多应用不足。在此上下文中的一个关键主题是该新一代高精度CCM的探测工具,因为它们是测量链中的第一部分 - 直接影响总系统的准确性。因此,在过去几年中,使用微型技术制造方法(1),已经制定了一些新的方法来开发和实现高精度CCM的探测工具。这些活动基于三个轴向触觉力传感器概念,其显示能够用作微探针(1)。

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