首页> 外文会议>International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference >PARTICLE SIZE DISTRIBUTION DETERMINATION OF CMP ABRASIVE PARTICLES USING DENSITY GRADIENT STABILIZED CENTRIFUGAL SEDIMENTATION
【24h】

PARTICLE SIZE DISTRIBUTION DETERMINATION OF CMP ABRASIVE PARTICLES USING DENSITY GRADIENT STABILIZED CENTRIFUGAL SEDIMENTATION

机译:使用密度梯度稳定离心沉降的CMP磨料颗粒的粒度分布测定

获取原文

摘要

Particle size distribution determination is conducted using density gradient stabilized centrifugal sedimentation in a disc centrifuge. Resulting particle diameter distribution determinations for cerium oxide, colloidal silica, fumed silica and alumina are shown to be highly repeatable and reproducible; and in many instances the measured diameter distributions exhibit resolved multimodal features. A detailed investigation of the experimental parameters used in the analysis revealed that the chemistry of the sample and the gradient e.g. pH of the slurry formulation, is the key parameter controlling the reliability of the measurement. For example, the diameter distribution of the particles in a cerium oxide slurry at pH 4.2 had a lower weight-average diameter than a cerium oxide slurry prepared at pH 5.2. the control of pH was also found to be critical for successful particle diameter analyses of the abrasive particles in colloidal silica slurries, fumed silica and alumina slurries. The adsorption of organic substances onto abrasive slurry particles altered the slurry's particle diameter distribution. The observed dependence of changes in particle diameter on the amount and type of the polymeric additive employed in the formulation points to adsorption of polymer onto abrasive particles; and indicates a high degree of sensitivity in the measurement to binding interactions between abrasive particles and the non-particulate chemical components in CMP slurries.
机译:使用圆盘离心机中的密度梯度稳定的离心沉降进行粒度分布测定。得到氧化铈,胶体二氧化硅,气相二氧化硅和氧化铝的粒径分布测定被显示为高度可重复和可重复的;在许多情况下,测量的直径分布表现出解决的多峰特征。对分析中使用的实验参数的详细研究表明样品的化学和梯度。浆料配方的pH是控制测量可靠性的关键参数。例如,在pH4.2的氧化铈浆料中的颗粒的直径分布具有比在pH5.2中制备的氧化物浆料的重量平均直径较低。还发现对pH的控制对于胶体二氧化硅浆料中的磨料颗粒,气相二氧化硅和氧化铝浆料的成功粒径分析至关重要。有机物质对磨料浆料颗粒的吸附改变了浆料的粒径分布。观察到粒径变化对制剂中使用的聚合物添加剂的量和类型的依赖性,以吸附聚合物到磨料颗粒上;并且表明测量磨料颗粒与CMP浆料中的非颗粒化学成分之间的结合相互作用测量的高敏感性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号