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Mechanism and kinetics of chalcopyrite passivation during bacterial leaching

机译:细菌浸出过程中杀菌剂钝化的机制和动力学

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Electrochemical measurements using a chalcopyrite electrode, coupled with chemical leaching experiments, were used to study the interactions between chalcopyrite leaching, temperature, Fe in solution and surface modifications. Leaching of chalcopyrite presented two-stage kinetics: an induction period and a linear kinetics. The induction period decreased with increasing temperature. It was found that chalcopyrite dissolution was accelerated at high temperature and low potentials. The results showed that chalcopyrite passivation can be explained by two different mechanisms. At low temperature and low potentials the leaching rate seems to be retarded by the formation of a copper-rich polysulphide. A ratio of dissolved copper to iron of 1:3 was obtained at a constant potential of 0.450 V vs SCE. The leaching rate also decreases at high temperature and high potentials, possibly due to the precipitation of ferric ions that hydrolyze to form iron-hydroxy compounds. There was a good agreement between electrochemical data and the results of chemical leaching tests.
机译:使用与化学浸出实验相结合的电化学测量,用于研究溶液浸出,温度,Fe在溶液和表面修饰之间的相互作用。氯偶矿的浸出呈现了两级动力学:诱导期和线性动力学。诱导期随着温度的增加而降低。发现在高温和低电位下加速了黄铜矿溶解。结果表明,硫代铜矿可以通过两种不同的机制解释。在低温下,低电位似乎通过形成富含铜的多硫化物延迟浸出率。在0.450V与SCE的恒定电位下获得溶解铜与熨斗的比例。浸出速率在高温和高电位下也降低,可能是由于水解形成铁 - 羟基化合物的铁离子的沉淀。电化学数据与化学浸出试验结果之间存在良好的一致性。

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