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Effect of high pressure torsion on crystal orientation to improve the thermoelectric property of a Bi_2Te_3-based thermoelectric semiconductor

机译:高压扭转对晶体取向的影响改善基于Bi_2Te_3的热电半导体的热电性能

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A Bi_2Te_3-based thermoelectric semiconductor was subjected by high pressure torsion (HPT). Sample disks of p-type Bi_(0.5)Sb_(1.5)Te_(3.0) were cut from sintered compacts that were made by mechanically alloying (MA) followed by hot pressing. Disks were subjected by HPT with 1, 5 and 10 turns at 473 K under 6.0 GPa of pressure. Crystal orientation was investigated by X-ray diffraction. Microstructures were characterized using scanning electron microscopy. Results indicated that HPT disks after 5 turns had a preferred orientation and a fine grain compared with pre-HPT disks while the orientation factor was decreased after HPT using 10 turns. The power factor had a maximum value at 5 turns as determined by measuring its thermoelectric properties. A maximum power factor of 4.30×10~(-3) Wm~(-1)K~(-2) was obtained for HPT disks after 5 turns. This value was larger than that for the pre-HPT disk. The over-HPT of 10 turns was found to have caused a decrease in the preferred orientation leading to a low power factor.
机译:基于Bi_2Te_3的热电半导体受高压扭转(HPT)。 P型Bi_(0.5)SB_(1.5)TE_(3.0)的样品磁盘从机械合金化(MA)之后由机械合金化(MA)进行的烧结体切割。通过HPT在6.0GPa的压力下以473k旋转的HPT进行磁盘。通过X射线衍射研究了晶体取向。使用扫描电子显微镜表征微观结构。结果表明,与HPT磁盘相比,5转弯后的HPT盘具有优选的取向和细粒,而使用10转的HPT在HPT后取向因子。通过测量其热电性能来确定功率因数在5时的最大值。在5转弯后,获得了HPT盘的最大功率因数为4.30×10〜(-3)Wm〜(-1)k〜(-2)。该值大于预HPT磁盘的值。发现10个转弯的过度HPT导致优选取向的降低导致低功率因数。

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