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Laser micro manufacturing of moulds and forming parts

机译:激光微型制造模具和形成零件

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The manufacturing of micro parts is mainly done in silicon, where manufacturing technologies from electronic production can be used. In cases, where the mechanical and structural properties of silicon are not sufficient or the costs of silicon micro parts can not be effort, other materials like polymers and metals have to be used. In this cases laser technologies can be a versatile tool for the production of tools, like moulds and stamping and embossing tools or the micro parts directly. Short pulse lasers, especially frequency-tripled, diode pumped Nd:YAG-lasers with a high beam quality offer the possibility to ablate these materials with high quality. With a spot size of about 10 μm, high fluences (>100 J/cm~(2)) can be achieved, so that the materials are vaporised without or with only a small amount of molten material. This technique is applicable for the production of micro tools with accuracies <10 μm at three dimensional microstructures. With optimised machining parameters the surface roughness can be reduced to R_(a)≤0.1 μm.. Depending on the material and the machining parameters the slicing thickness is in the range of 1 to 10 μm.
机译:微部件的制造主要在硅中进行,可以使用电子生产的制造技术。在硅的机械和结构特性不充分或硅微部件的成本不能努力的情况下,必须使用聚合物和金属等其他材料。在这种情况下,激光技术可以是用于生产工具的多功能工具,如模具和冲压和压花工具或直接微型部件。短脉冲激光器,尤其是变频,二极管泵浦ND:具有高光束质量的YAG-Lasers提供了高质量的烧蚀这些材料的可能性。斑点尺寸约为10μm,可以实现高流量(> 100J / cm〜(2)),从而蒸发材料而没有或仅具有少量熔融材料。该技术适用于在三维微结构的三维微观结构中产生具有精度<10μm的微型工具。利用优化的加工参数,表面粗糙度可以减小到R_(a)≤0.1μm..取决于材料和加工参数,切片厚度在1至10μm的范围内。

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