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High-speed deposition of SiC thick film by halide precursor

机译:卤化物前体的高速沉积SiC厚膜

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Polycrystalline P-SiC thick film with mm-scaled thickness was deposited on a graphite substrate using a gaseous mixture of SiCl_4 + CH4 and H_2 at temperatures ranging from 1573 to 1823 K by chemical vapor deposition. Effect of deposition temperature (R_deP) on deposition rate, surface morphology and preferred orientation has been studied. The preferred orientation changed from <111> to <110> with increasing T_deP. The maximum deposition rate (R_deP) of 1125 μm IT~(-1) has been obtained. The surface morphology has changed from six-fold pyramid to five-fold facet with increasing R_deP
机译:通过化学气相沉积在1573至1823k的温度范围内,使用SiCl_4 + Ch 4和H_2的气态混合物在石墨衬底上沉积具有mm-缩放厚度的多晶p-SiC厚膜。研究了沉积温度(R_DEP)对沉积速率,表面形态和优选取向的影响。随着T_DEP的增加,优选方向从<111>变为<110>。已经获得了1125μm的最大沉积速率(R_dep)〜(-1)。随着R_DEP的增加,表面形态从六倍的金字塔变为五折正面

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