The solid state joining process "diffusion bonding" is used more often worldwide because of the process properties like areal joint without any additional filler material. Examples of application are optical devices, micro fluidic components or heat transfer elements and heat exchangers. The market for diffusion bonded parts is growing fast, but it is still small today. Despite this, more than 30 companies offer diffusion bonding systems all over the world. In this contribution, different commercially available diffusion bonding systems as well as lab scale solutions are presented as well as design principles and their differences. One of the most important criteria is to achieve a homogenous load distribution in the parts to join. For this, different concepts will be shown, too.
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