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Computational simulation of diffusion process in multicomponent and multiphase systems in diffusion bonding

机译:扩散键合中多组分多相系统扩散过程的计算模拟

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Diffusion bonding is a solid state welding process useful for joining similar and dissimilar metals.nIn the present paper, the interdiffusion occurring during the diffusion bonding of Al to Zn, Al to Mg,nand one Ni base alloy to another was investigated. The composition profiles across the interface,nthe thickness of the diffusion layer and the growth of phases at the interface were computed usingnthe diffusion software Pandiffusion and the thermodynamic and kinetic databases of Pandat. Thencalculated results agreed well with existing experimental data. Thus, it was demonstrated thatnthese software and databases can be useful for studying diffusion bonding and reducing thennumber of trial-and-error experiments.
机译:扩散键合是一种固态焊接工艺,可用于连接相似和不相似的金属。n本文研究了铝与锌,铝与镁,一种镍基合金与另一种镍基合金的扩散键合过程中发生的相互扩散。使用Pandiffusion扩散软件和Pandat的热力学和动力学数据库,计算了整个界面的成分分布,扩散层的厚度以及界面处的相增长。计算结果与现有实验数据吻合良好。因此,证明了这些软件和数据库可用于研究扩散结合并减少试错实验的次数。

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