High Modulus Tight Buffer Design with improved Microbend Resistance and Low Temperature Performance

摘要

A dual layer buffering system employing a new compliant layer is described and its performance is compared with the former dual layer and conventional single layer buffering systems. Buffer materials, whose flexural modulus is higher than typical buffer materials, such as PVC, are needed for high performance and high reliability pull-proof connectors. In addition, systems are now moving towards higher bandwidth capable fibers, like the 50 μm multi-mode LaserWave fibers with reduced differential modal dispersion (DMD). Unfortunately, 50 μm multi-mode fibers are approximately three (3) times more microbend sensitive than 62.5 um multi-mode fibers. While the current dual layer system is adequate for 62.5 multi-mode and single mode optical fibers, a dual layer system with a new compliant layer was developed to handle the more microbend sensitive 50 μm fiber. The new system is shown to have much lower microbend sensitivity minimizing the difference seen between 62.5 and 50 μm buffered fibers. The new dual layer tight buffer system also has much lower attenuation during loose coil temperature cycling tests.