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Microstructure Evolution During Hot Working of an Al-Li-Cu-Mn Alloy

机译:Al-Li-Cu-Mn合金热工作过程中的微观结构演变

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The 2090 experimental alloy was deformed in torsion in the temperature range of 300 deg C through 500 deg C at strain rates of 0.01 to 5 s~(-1). The torsion results were analyzed using the equation A (sinh alpha sigma)~n = Z = epsilon exp (Q_(HW)/RT), where Z is the Zener-Hollomon parameter. For the stress multiplier alpha = 0.052 kJ/mol, an activation energy of 219 kJ/mol was determined. During hot working, the mechanism of dynamic recovery was operating. The average subgrain size (d) changed with the conditions of deformation according to the relationships: d~(-1) = 0.057 InZ - 1.619 and sigma_m = 155.036 d~(-1) - 5.33. The need to reduce the anisotropic behaviour through a better understanding of deformation mechanisms was the overall goal of this research. Studies using transmission electron microscopy (TEM) were performed with the aim of understanding the difference in deformation mechanisms at 500 deg C, 400 deg C, and 300 deg C. Electron microscopic analyses have revealed a large number of helical dislocations after deformation at 500 deg C. The nature and density of precipitates depends on deformation temperature and strain rate. The properties of a material during hot working are influenced by heterogeneous precipitation, which occur on dislocations and grain boundaries. Dynamic precipitation, especially T_1 phase, influences mechanical properties of 2090 alloy.
机译:2090实验合金在300℃至500℃的温度范围内以0.01至5s〜(-1)的应变率的温度范围的扭转变形。使用等式a(sinh alpha sigma)〜n = z = epsilon exp(q_(hw)/ Rt)分析扭转结果,其中z是zener-hollomon参数。对于应力倍增器α= 0.052kJ / mol,测定219kJ / mol的活化能。在热工作期间,动态恢复机制运行。平均子粒尺寸(d)根据关系的变形条件改变:D〜(-1)= 0.057 inz - 1.619和Sigma_m = 155.036d〜(-1) - 5.33。通过更好地理解变形机制来减少各向异性行为是本研究的总体目标。使用透射电子显微镜(TEM)的研究旨在了解500℃,400℃和300℃的变形机制差异的差异,电子显微镜分析在500℃变形后揭示了大量螺旋脱臼C.沉淀物的性质和密度取决于变形温度和应变率。在热工作期间材料的性质受到异质沉淀的影响,这发生在脱位和晶界上。动态沉淀,特别是T_1相,影响2090合金的机械性能。

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