Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between -180°C and 80°C

摘要

Packaging-induced die-stresses due to temperature effects on various materials of the package are characterized using piezoresistive van der Pauw stress sensors over a temperature range of -180°C to 80°C. Piezo-resistive coefficients extracted previously are then used to obtain a mapping between change in resistance and corresponding stress at all tested temperatures. The obtained values of stress are compared with finite element simulation results.