In the past few years, embedding has emerged as a valid contender to traditional packaging technologies for specific applications. It uses PCB (Printed-Circuit Board) processes for 3D integration of active and passive elements to create SiPs (System in Package). Just like MEMS (Micro Electro-Mechanical System) and IPD (Integrated Passive Device) emerged from standard semiconductor processes, and then were adapted to match the specific requirements, so does embedding build on decades-old techniques to create this new class of packages. Inherent advantages include: -Compatibility with traditional SMTprocesses, in particular with regards to pitch, -Production batch size, -Historical reliability and process data, -Thermal management, -Possibility to integrate EMI shielding, -CTE matching. This paper will present the challenges and opportunities of this packaging technology in terms of processes, performance and reliability. It will focus on the solution developed by AT&S called ECP? (Embedded-Component Packaging). Whereas competition is integrating PCB processes to their semiconductor-packaging operations, AT&S is the only vendor building on its PCB tradition to enter the packaging industry, thereby presenting an alternative view of the subject.
展开▼
