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New Mixed Metal Transition Via-Fill Conductors for Cost Effective DuPont GreenTape 951 9K7 LTCC Circuits

机译:新的混合金属过渡通孔导线用于成本效益杜邦Greentape 951&9K7 LTCC电路

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LTCC (Low Temperature Co-fired Ceramic) technology provides an option for circuit designers that combines the benefits of HTCC and thick film technologies and is the technology of choice for many complex automotive, consumer, and military applications. For demanding and high reliability applications, LTCC circuits containing gold conductors for all ground planes, signal traces, and via fills are common. With the rise in gold cost from $400/TO in 2005 to a recent peak of over $1,200/TO in 2009, OEMs and circuit designers are forced to seek lower cost alternatives to all gold LTCC structures. The use of all silver conductors raises questions of reliability, especially for the external silver layers, and wire-bonding to silver is not possible. The traditional method employed to address cost and reliability has been the use of mixed metallurgies, rather than using gold throughout the LTCC module. Silver based conductors for signal and ground are used internally, with gold conductors for wire bonding, brazing, or soldering on the external surfaces. Today there are two primary options to achieve this type of structure: 1) Ni/Au plating the top silver surface; or 2) Use of precious metal based transition via fill compositions that interconnect the silver to the gold conductors. Traditional LTCC transition via fills compositions have consisted of Pd/Ag or Pd/Pt/Ag mixtures. However, such systems may be disposed to certain phenomena at the surface interface(s) between dissimilar metals. For example, the Kirkendall Effect has been found in various alloy systems and can impact the bonding between different materials. In particular, it has been studied and is used to describe voids that are produced in the boundary region at a bonding interface especially during high temperature processes such as metallic powder sintering. This paper introduces two new mixed metal via-fill conductors that are compatible with the DuPont GreenTape 951 and 9K7 LTCC systems. Reliability and refire stability are described in detail.
机译:LTCC(低温共用陶瓷)技术为电路设计人员提供了一种选择,它结合了HTCC和厚膜技术的好处,是许多复杂的汽车,消费者和军事应用的首选技术。对于要求苛刻和高可靠性应用,含有用于所有地面平面,信号迹线和填充物的金导体的LTCC电路很常见。随着2005年的400美元/至2005年的黄金成本上涨至2009年的最近峰值超过1,200美元,OEM和电路设计人员被迫寻求所有金LTCC结构的较低的成本替代品。所有银导体的使用提高了可靠性的问题,特别是对于外部银层,不可能与银引线。用于解决成本和可靠性的传统方法是使用混合冶金,而不是在LTCC模块中使用金。用于信号和地面的基于银的导体在内部使用,用金导体用于电线键合,钎焊或焊接在外表面上。今天有两种主要选择来实现这种结构:1)Ni / Au电镀顶部银色表面;或者2)通过填充组合物的贵金属基转变的使用与金导体相互连接的填充组合物。通过填充组合物的传统LTCC转变组由Pd / Ag或Pd / Pt / Ag混合物组成。然而,这种系统可以设置在不同金属之间的表面界面处的某些现象。例如,在各种合金系统中发现了Kirkendall效果,并且可以影响不同材料之间的粘合。特别地,已经研究过,用于描述在粘合界面处的边界区域中产生的空隙,特别是在诸如金属粉末烧结的高温过程中。本文介绍了与杜邦Greentape 951和9K7 LTCC系统兼容的两个新的混合金属通孔导线。详细描述了可靠性和资料稳定性。

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