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Depletion and Accumulation Mode Operation of GaAs MISFETs with nm-Thin Gate Insulating Layers Formed by UV Ozone process

机译:通过UV和臭氧过程形成GaAs MISFET的耗尽和累积模式操作

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UV & ozone process converts a surface of a semiconductor into an insulator and is useful to form a nm-thin and uniform thickness insulating layer. The authors fabricated Ni/oxidized-GaAs/n-GaAs (MIS) FETs by using the UV & ozone process for 120 min and 240 min at room temperature. They can be operated not only in the depletion mode but also in the accumulation mode up to 2 V (120 min) and 3 V (240 min) due to current suppressing effect of the insulator, although their current-voltage curves have hysteresis suggesting existence of interface states.
机译:UV和臭氧过程将半导体的表面转换为绝缘体,并且可用于形成NM薄且均匀的厚度绝缘层。作者通过在室温下使用UV和臭氧方法120分钟和240分钟制造Ni /氧化 - GaAs / N-GaAs(MIS)FET。由于绝缘子的电流抑制效果,它们可以不仅在耗尽模式下运行,而且还可以在耗尽模式中操作,而且还可以在累积模式中操作,但由于绝缘体的电流抑制效果,累积模式和3V(240分钟),尽管它们的电流 - 电压曲线具有滞后表明存在接口状态。

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