In this study Micro Laser Assisted Machining (μ-LAM) is coupled with Single Point Diamond Turning (SPDT) to machine an unpolished single crystal silicon (Si) wafer. Cutting fluids, distilled (DI) water and mineral spirit, were used to decrease tool wear and increase surface quality. Results were very promising for using this process for machining of unpolished Si wafers. It has been shown that combination of laser and cutting fluid not only increases the tool life but also improves the surface quality significantly. Surface finish was improved from 1.2μm (as-received) to approx. 80 nm by using this process in optimal condition.
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