Investigations of 300mm wafer tool set progress and performance

摘要

The semiconductor industry is now solidly in the 300mm wafer size conversion. The majority of new factories are being built, equipped and started-up as 300mm facilities. This conversion is being accomplished during the 0.13μ device technology introduction and volume manufacturing will anticipate 0.10μ nodes for these factories. Data from SEMICONDUCTOR300 (SC300) was used to evaluate the performance the 300mm tool set against world-class metrics for the 200mm equivalent tool set. This data included metrics such as wafer run cost, throughput, uptime, and Cp/Cpk. The tool group performance was assessed during the project, compared to the anticipated performance issues and benchmarked against the 200mm equivalent tool. While most process tool groups had significant challenges, but they were not immense or insurmountable.