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In-process measurements of material removal in fluid jet polishing

机译:流体射流抛光中材料去除的过程中的进程测量

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摘要

A prototype of a system for in-process monitoring of material removal in fluid jet polishing (FJP) is presented. The measurements make use of temporal phase unwrapping (TPU) allowing for a large working range. The measurement system will be discussed, with all problems that had to be overcome like water on the surface and vibrations, as well as the FJP system. The basics behind TPU will be presented and the first results will be shown. Finally, the capabilities of the system will be discussed. The presented system enables the in-process monitoring of the footprint as obtained by the FJP technique and measurement of the material removal rate.
机译:提出了一种用于流体喷射抛光(FJP)中材料去除的过程中的系统的原型。测量利用允许大型工作范围的时间相位展开(TPU)。将讨论测量系统,所有问题都必须克服表面和振动等水,以及FJP系统。将显示TPU后面的基础知识,并将显示第一个结果。最后,将讨论系统的能力。所提出的系统使得通过FJP技术获得的占地面积和材料去除率的测量来实现占地面积。

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