Room-Temperature YBaCuO Infrared Detectors on a Flexible Substrate

摘要

Infrared microbolometer thermal detectors have been fabricated on a flexible substrate, a polyimide that shows very similar characteristics to Kapton~(~R), when cured. The polyimide is spin-coated on a regular Si wafer with a release layer. Low temperature fabrication techniques are employed to minimize the thermal cycling of the polyimide substrate as well as to maintain compatibility with CMOS circuitry. Infrared microsensors on flexible substrates showed a Temperature Coefficient of Resistance (TCR=(1/R)(dR/dT)) of -3.03%, at room temperature. The microbolometers reached the responsivity and detectivity of 3.5xl0~3 V/W and 1x10~7 cm.Hz~(1/2)/W, respectively, at 2.88 μA of current bias even though at this time no micromachining has been performed. Some devices were encapsulated between polyimide layers in order to provide protection and passivation. These bolometers demonstrated a responsivity and detectivity of 1.6xl0~3 V/W and 4.9xl0~6 cm.Hz~(1/2)/W, respectively at 1 μA of current bias. This is the first attempt towards a "smart skin" that incorporates flexible microsensors on a cured polyimide-substrate.