A newly developed antioxidant package whose performance is unaffected by the presence of copper or color

摘要

Accelerated heat aging data generated from tensile tests at 165°C indicate that a newly developed antioxidant system for wire and cable compounds results in superior heat aging performance over current commonly used systems. The heat aging performance of Compound A, based on the new antioxidant system; is approximately twice as good as that of Compound B, which is based on a more commonly used system. In addition, data is presented which shows that the heat aging performance of Compound A is unaffected by the presence of copper and a black color concentrate. This may partly explain the superior performance of this new system over those that are currently used.