首页> 外文会议>International SAMPE Symposium and Exhibition >GRAIN GROWTH BEHAVIOR OF NANOCRYSTALLINE ALUMINUM IN TRIMODAL METAL MATRIX COMPOSITE DURING THERMO-MECHANICAL PROCESSING
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GRAIN GROWTH BEHAVIOR OF NANOCRYSTALLINE ALUMINUM IN TRIMODAL METAL MATRIX COMPOSITE DURING THERMO-MECHANICAL PROCESSING

机译:纳米晶铝在热机械加工过程中纳米晶铝铝的生长行为

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Grain growth of nanocrystalline aluminum (ncAl) in trimodal Al metal-matrix-composites (MMCs) during hot forging was investigated. The ncAl phase formed through cryomilling of inert gas atomized powders in liquid nitrogen has an average grain size down to 21 nm and exhibits excellent thermal stability. However, substantial grain growth of ncAl up to 63 nm was observed when the Al MMCs were thermo-mechanically processed even at relatively low temperatures. Grain growth of the cryomilled ncAl phase in trimodal Al MMCs after hot forging was documented with respect to temperature ranging from 175 deg to 287 deg C, true strain ranging from 0.4 to 1.35 and strain rate ranging from 0.1 to 0.5 sec-1. Hollow cone dark field imaging technique was employed to quantify statistically confident measurements of ncAl grain size that ranged from 21 to 63 nm. An increase in forging temperature and an increase in true strain were correlated with an increase in grain size of ncAl. Results were correlated to devise a phenomenological grain growth model for forging that takes strain, strain rate and temperature into consideration. Activation energy for the grain growth during thermo-mechanical hot-forging was determined to be 35 kJ/mole, approximately a quarter of activation energy for bulk diffusion of Al and a half of the activation energy for static recrystallization.
机译:研究了在热锻造期间纳米晶铝(NCAL)纳米晶铝(NCAL)的谷物生长。通过惰性气体冷冻液中的液氮中雾化粉末形成的NCAL相的平均晶粒尺寸下降至21nm,并且具有优异的热稳定性。然而,当甚至在相对低的温度下,当Al MMC热机械加工时,观察到NCAL的大量晶粒生长至63nm。在热锻造后的粒子AlMMCs中,在热锻中的温度范围内的温度范围为175℃,真正的应变范围为0.4至1.35,应变率范围为0.1至0.5秒-1。空心锥形暗场成像技术用于量化统计学上的核晶粒尺寸的测量范围,范围为21至63nm。锻造温度的增加和真实菌株的增加与NCAL的晶粒尺寸的增加相关。结果与考虑应变,应变率和温度的锻造现象晶粒生长模型进行相关性。测定热机械热锻期间晶粒生长的激活能量为35kJ /摩尔,大约四分之一的激活能量,用于Al的散装扩散和一半的活化能量,用于静态再结晶。

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