Benzoxazine new chemistry for building advanced printed wiring boards

摘要

This paper describes our efforts in the development of benzoxazines in general, with a specific emphasis on the development of products for the Printed Wiring Board [PWB] applications. Organic polymers play a very important role in the manufacture of s PWBs Typically polymers such as epoxies, phenolics, bismaleimides and cyanate esters have been used for manufacturing PWBs. Polymers give the PWB composite its important properties such as: electrical insulation, thermal properties, chemical resistance and the mechanical strength necessary for building complex electrical equipment. The dielectric constant [Dk] and the dissipation factor [Df] are very important properties for the PWB resin systems. Today's new applications demand lower Dk and Df values for use in PWB manufacturing. PWB laminates with a low Dk and Df are used in high-speed logic circuits, RF/microwave telecommunications, and other applications requiring high circuit density with tight spacing and faster signal speeds. The electrical requirements for new PWBs are beyond the capabilities of the typical epoxy resin systems used for manufacturing PWBs. Several proprietary benzoxazines synthesized in our laboratories have shown electrical characteristics that make them very good candidates for PWB applications. Several benzoxazines have much lower dissipation values than the typical epoxy resin systems; and some of these benzoxazines also have lower dielectric constants than epoxies. These benzoxazines are the basis for our development work to produce a low DK & Df resin system, RD2000-56, for PWB applications.