Integrated imaging sensors

摘要

The objectives of the Integrated Imaging Sensors (I{sup}2 S) Program are twofold. The first is to develop and deliver a rifle sight containing a single aperture and optical path for receiving, combining, and viewing radiation from the separate infrared (IR) and visible bands in a single image simultaneously. The second is to develop a sensor array sensitive in the radiation band spanning approximately from 0.4 μm to 1.7 μm by “fusing" indium-gallium-arsenic material onto silicon charge coupled devices. The ability to coincidentally and simultaneously form images from these two separate radiation bands is expected to significantly improve the detection and identification of objects from the case where only one radiation band is employed. Additionally, extending the cutoff of the visible band from 0.9 μm to 1.7 μm is expected to enhance viewing in this band as there is more available light, and further lessens the exacting requirement of designing nearly noise free detectors.