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Comparison of Wax and Wax-free Mounting of Irregular Piezocomposite Materials for Thinning for High-frequency Medical Devices

机译:不规则压电复合材料对高频医疗器械稀疏的蜡和无蜡安装的比较

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Ultrasound is used in more than 20% of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and increase the yield of such components when they reach production.
机译:超声用于超过20%的生物医学成像扫描。几种临床应用将从更高频率操作所提供的较高空间分辨率显着受益于目前是常见的。超声成像阵列的开发中以在高于30MHz的频率下操作的关键问题是需要阵列电极的光刻图案化。为了直接在压电陶瓷 - 聚合物复合材料的表面上达到这一点,需要平面,平行和平滑的表面。通过机械研磨和/抛光对压电复合材料表面精加工的研究最近证明了可以获得优异的表面平坦度。然而,由于所需的温度,在表面处理期间使用蜡安装导致问题,并且需要在精加工后从非常脆弱的基板中除去蜡。传统的带式安装不能承受由复合发育过程目前生产的不规则形状的样品产生的高横向力。采用多孔陶瓷真空夹头在另外标准的机械研磨/抛光设备中,采用多孔陶瓷真空夹头开发了无蜡安装。已经在复合表面上成功地制造了高频阵列元件,并获得了良好的电极边缘定义和与复合材料的电接触。预计使用无蜡设备和技术的使用将降低最终成本并在达到生产时提高这些组件的产量。

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