Abstract MC26 - Stretching the Limits of Legacy Equipment - A Breakthrough Approach Towards Productivity

摘要

Ball Attach is an old technology machine with complicated process incurring high cycle time, as well as technology limitation that only configures for maximum of 30 mil diameter solder ball technology. As the product technology gets more complicated, 24 mil diameter ball technology was introduced to run in this legacy tool in Q2'02. The main challenge came in the form of smaller solder balls, which is 20% reduction in ball diameter & 49% lighter in weight. With the gravity ball placement technology, lightness has created a lot of problems to placement process such as solder ball not dropping as expected thus higher stuck ball assist or low MTBA. This induced much lower run rate that encountered on FCBGA1 1 mm ball pitch technology product with 22% lower than FOR. With the steep ramp of chipset, the challenge got harder with >30% productivity improvement required to avoid 4 new tool purchase by Q1'03, costing USD3.28M. The audacious challenge faced by the team prompted us to study equipment capacity improvement and overall equipment efficiency.