New Directions in Thermal Batch Processing

摘要

"Mini-batch" vertical furnaces incorporating smaller batch size and reduced cycle tune have throughputs and process flexibility making them competitive with single wafer or large batch thermal processing systems for both 200 and 300-mm wafer processing. This "mini-batch" system concept is a good equipment solution for many types of fabs and provides an additional equipment option in designing 200/300-mm fabs such as IDM fab lines for high operational efficiency. This paper introduces a new mini-batch furnace system from ASML featuring outstanding process performance and flexibility in an exceptionally compact footprint. Unique features include use of a unique chamber design for CVD and a unique model based type of feed forward process control.