Investigation of spurious coupling influence on the quality of the microelectronic equipment

机译：对微电子设备质量的杂散耦合影响研究

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摘要

In this paper were introduced the results of elaboration software-methodical package for spurious coupling account.

机译：本文介绍了用于杂散耦合账户的阐述软件封装的结果。

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《International Conference on Experience of Designing and Application of CAD Systems in Microelectronics》|2001年||共2页
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作者
Angelika Parhomenko;
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原文格式 PDF
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中图分类 TN4-53;
关键词
Spurious coupling; Topology; Microassembly; Model; Software-methodical package;

机译：杂散耦合;拓扑;微型装配;模型;软件 - 方法包;

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Investigation of spurious coupling influence on the quality of the microelectronic equipment

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