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首页> 外文期刊>IFAC PapersOnLine >Prediction of the Wafer quality with respect to the production equipments data This work is part of the European project “INTEGRATE”, and carried by ST-microelectronics Fab.
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Prediction of the Wafer quality with respect to the production equipments data This work is part of the European project “INTEGRATE”, and carried by ST-microelectronics Fab.

机译:关于生产设备数据的晶圆质量的预测 < ce:footnote id =“ fn1”> 此作品是欧洲项目“整合”的一部分,由ST-microelectronics Fab生产。

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This paper deals with the prediction of wafers quality, according to the health indicators of manufacturing equipments in the semiconductor industry. The proposed approach is based on the pattern recognition principle by using a historical data of health indicators, associated to the reconstructed data of quality measurements of wafers. The aim is to construct clusters that represent the normal and the known faulty operations. Then, the Remaining Useful Life in terms of number of Wafers (RUW) is estimated by monitoring the trajectory and velocity of the degradation phenomenon.
机译:本文根据半导体行业制造设备的健康指标,对晶圆质量进行了预测。所提出的方法基于模式识别原理,通过使用健康指示器的历史数据,该历史数据与晶片质量测量的重构数据相关联。目的是构建代表正常和已知故障操作的群集。然后,通过监测退化现象的轨迹和速度来估算以晶圆数量(RUW)表示的剩余使用寿命。

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