The main objective of our study is to advance pulse deposition methods for quality finishing through exploring the potential of pulse reversing systems. We have previously showed that leveling power can be used as an objective criterion for property estimation of d-c or pulse deposited metal coatings. The symmetry of cathodic processes and the processes of active anodic dissolution justifies the application of the same approach of leveling investigations in unipolar pulse deposition of metal coatings to the case of pulse periodic reverse plating. In the present study we have similarly varied anodic pulse frequency in order to determine pulse parameters, at which the leveling maximum occurs. The potentiostatic application of small anodic pulses with the amplitude up to 100 mV at definite frequencies creates the specific conditions for diffusion and adsorption of various kinds of ions and organic molecules mainly on the protrusions of microprofile of the metal surface. The experimentally obtained relationship between leveling power (LP%) and pulse frequency (f,Hz) determines the frequency of the anodic pulses, at which the leveling maximum occurs. Thus, the application of a sequence of cathodic (forward) pulses followed by anodic (reverse) pulses both arranged by frequency of maximum leveling power adds to a commutative effect and results in the deposition of coatings with the best properties. Maximum values of leveling power of copper and nickel coatings produced by pulse periodic reverse plating are compared to those of d-c and pulse deposits.
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