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Investigations of Phase Growth in the Copper-Tin System

机译:铜锡系统中相生长的研究

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Cu specimens were coated electrolytically with 20m Sn and subsequently heat treated at T = 473 K for either 500 or 1000 hours. This paper deals with the growth process of the intermetallic compounds Cu_3Sn (ε phase) and Cu_6Sn_5 (η phase) analysed by glow discharge optical emission spectrometry (GD-OES) and by metallography. The results obtained from both methods are in good agreement. During the heat treatment, the Sn layers and the η phase became porous and thus, the calculated layer thicknesses, upon assuming a density equal to that of the compact solids, are different from the measured values.
机译:用20M的Sn电解涂覆Cu标本,随后在T = 473k处热处理500或1000小时。本文涉及通过辉光放电光发射光谱(GD-OE)和金属谱系分析的金属间化合物Cu_3SN(ε相)和Cu_6SN_5(η相)的生长过程。两种方法获得的结果很好。在热处理期间,Sn层和η相变为多孔,因此,计算的层厚度在假设相同的密度等于紧凑型固体的密度不同于测量值。

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