The evolution of surface structures of coevaporated and sputtered amorphous Zr{sub}65Al{sub}7.5Cu{sub}27.5 films with varying deposition conditions is investigated primarily with scanning tunneling microscopy (STM). While vapor deposited thin films reveal pronounced structure formation, depending on parameters, such as substrate temperature, film composition (variation of the Al versus the Cu content) and the angle of incidence, comparable sputtered films hardly show any structure formation. With the help of a numerical analysis of the STM data, surface diffusion, self-shadowing and energy transfer in the case of sputtering can be identified as the main structure forming mechanisms. Presuming these atomic processes, it is possible to model the main experimentally observed features of amorphous thin film growth by the use of stochastic continuum growth equations, which are numerically solved. Additionally, the connection to intrinsic stress formation during film growth is discussed.
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