Removal Characteristics of Plasma Chemical Vaporization Machining with a Pipe Electrode

摘要

Plasma chemical vaporization machining (CVM) is a high-precision chemical shaping method using rf plasma generated in the proximity of an electrode in an atmospheric environment. The purpose of the present study is to clarify the removal characteristics of plasma CVM, such as the removal rate and the surface roughness. Polished fused silica plates were processed by plasma CVM, polishing and precision grinding under various conditions. The removal rate of the plasma CVM was about 4 times to 1100 times faster than that of polishing, and the maximum removal rate was almost equal to that of precision grinding. The roughnesses of the resultant surfaces were almost the same as that of the polished surface.