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Exact inductive parasitic extraction for analysis of IGBT parallel switching including DCB-backside eddy currents

机译:IGBT平行切换分析的精确感应寄生提取,包括DCB-背面涡流

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This paper deals with the parallel switching process of IGBTs in a power module. It is shown experimentally and by simulation that eddy currents in the direct copper bonding (DCB) ceramics backside metallization have an important influence on switching behaviour. An effective simulation tool based on the partial element equivalent circuit (PEEC) method is used to extract all inductive couplings for circuit modeling.
机译:本文涉及电源模块中IGBT的并联切换过程。实验和通过模拟示出,仿真直接铜粘合(DCB)陶瓷背面金属化对切换行为有重要影响。基于部分元素等效电路(PEEC)方法的有效仿真工具用于提取电路建模的所有电感耦合。

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