Site-specific, chip-to-chip fluidic connectors have been demonstrated via near-field electrospinning (NFES) in a fashion similar to the wire bonding technique in IC manufacturing. Electrospun polymer fibers function as the sacrificial material with deposition control better than 10μm in the planar direction to connect two separated chips. A coating process and sacrificial layer etching process are followed to make micro/nano fluidic channels of 50nm∼5μm in inner diameter. Preliminary parameter and flow characterizations have been conducted. As such, this fabrication/packaging technology could enable on-chip and off-chip fluidic transportations and networks in MEMS applications, including BioMEMS and microfluidics.
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