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Challenges of CMOS scaling at below 0.1 /spl mu/m

机译:CMOS缩放在低于0.1 / SPL MU / M的挑战

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Over the last two decades, CMOS scaling has been the main driver of the electronics industry. During the last few years, the pace of scaling has been accelerating, and we are approaching some fundamental limits. In this paper, some of the key challenges of CMOS scaling, as we move into the 0.1 /spl mu/m generation and beyond, are reviewed. They include challenges faced in short channel effects, gate oxide scaling, I/sub off/ and low voltage operation, metallization, and reliability. A few of the potential solutions to some of these problems are discussed. They include introduction of SOI and novel structures, high-k gate dielectrics, strained Si layers on SiGe, and low-T operation.
机译:在过去的二十年中,CMOS缩放一直是电子行业的主要驱动因素。在过去几年中,缩放的步伐一直在加速,我们正在接近一些基本限制。在本文中,综述了CMOS缩放的一些关键挑战,因为我们进入0.1 / SPL MU / M代或超越时,请审查。它们包括短频道效果,栅极氧化物缩放,I /次关闭/和低电压操作,金属化和可靠性所面临的挑战。讨论了一些这些问题的潜在解决方案。它们包括引入SOI和新型结构,高k栅极电介质,SiGe上应变Si层和低T操作。

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