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OPTIMIZING PRINTED CIRCUIT BOARD ASSEMBLY DURING THE DESIGN PROCESS

机译:在设计过程中优化印刷电路板组件

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This paper investigates the incorporation of optimization techniques early in the design process for the manufacturing process of printed circuit board (PCB) assembly. PCB design is a long process in which many sequential optimizations are performed with assembly optimization being the last. Since assembly optimization is not performed until the PCB design is completed it tends to be sub-optimal; however, engineers are reluctant to change the PCB design at that late stage due to market pressure for quick product introduction. This paper proposes a model which incorporates a PCB assembly optimization model into the PCB design stage when board layout occurs. The mathematical optimization model utilizes the available incomplete design information and provides a satisficing PCB layout with respect to routing performance and assembly objectives. A decision-making model is applied to facilitate the design engineer in harmonizing differences between the optimal assembly layout and the optimal electrical performance (routing) layout. The approach will enable the design engineer to analyze the trade-offs between cost (assembly) and performance (routing). The expected benefits are to reduce manufacturing cost and improve first-pass yield of the PCB. The methodology will be benchmarked against current approaches to quantify the improvements in manufacturability. Results of this work are illustrated and validated with several test cases.
机译:本文研究了在印刷电路板(PCB)组装的制造过程中的设计过程中的优化技术掺入。 PCB设计是一个很长的过程,其中通过装配优化来执行许多顺序优化是最后的。由于在PCB设计完成之前未执行组装​​优化,因此往往是次优的;然而,由于快速产品介绍,工程师在该晚期的阶段更加不愿意改变PCB设计。本文提出了一种模型,该模型将PCB组件优化模型结合到PCB设计阶段,当发生电路板布局时。数学优化模型利用可用的不完整的设计信息,并提供关于路由性能和装配目标的满足PCB布局。应用决策模型以方便设计工程师协调最佳装配布局和最佳电气性能(路由)布局之间的差异。该方法将使设计工程师能够分析成本(装配)和性能之间的权衡(路由)。预期的效益是降低制造成本并改善PCB的一级级别。该方法将与目前的方法进行基准测试,以量化可制造性的改进。用几种测试用例说明并验证了这项工作的结果。

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