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Inverse modeling for C-V profiling of modulated-doped semiconductor structures

机译:用于调制掺杂半导体结构的C-V分析的反向建模

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Inverse modeling is a way for the verification of device models and for the parameter extraction. A technique of doping profile extraction of semiconductor structures based on the capacitance-voltage measurements (or C-V profiling) is used extensively. This technique up till now has been applied in two variants: the well-known classical C-V profiling to the sufficiently smooth doping profiles and the inverse modeling technique based on the error minimization to the abrupt profiles. The present paper describes a new method of the inverse modeling with sub-Debye resolution for arbitrary doping profiles. The calculations can be performed using a Pentium-like personal computer. For the input data obtained by forward modeling, the integral error of doping profile extraction is below 0.1 %. As an example, the doping profile determination of the GaAs modulated-doped structure is presented. The possibilities of the proposed method are discussed.
机译:逆建模是一种验证设备模型和参数提取的方法。基于电容 - 电压测量(或C-V分析),使用掺杂型材提取的掺杂轮廓提取的技术。此技术直到现在两种变体:基于突然曲线最小化的误差最小化的众所周知的经典C-V谱和逆建模技术。本文介绍了具有任意掺杂型材的副德语分辨率的逆建模的新方法。可以使用像奔腾的个人计算机来执行计算。对于通过转发建模获得的输入数据,掺杂轮廓提取的积分误差低于0.1%。作为示例,呈现了掺杂剖面测定的GaAs调制掺杂结构。讨论了所提出的方法的可能性。

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