Ultra Wideband Vias and Power Dividers in Microstrip-Slot Technology

摘要

The design of ultra-wideband vias and power dividers in microstrip-slot technology is presented. The devices employ two substrates supported by a common ground plane. Their design is accomplished with the use of commercially available full EM analysis and design software. Low insertion loss and good return loss performances over an ultra wide frequency band for the designed structures are noted.