The Bole of the Interphase in the Mechanical Stability of Adhesive Bonds in Wood

摘要

The growing importance of bio-based composites requires an improved understanding of adhesive bonding, which is one of the crucial processing steps in the production of such composites. By means of nanoindentation and electronic speckle pattern inter-ferometry, extensive studies have been performed on the role of adhesive penetration into the wood structure on the micro- and nanoscopic levels. It was found that a certain amount of penetration of adhesive into the wood structure is probably beneficial to bond strength. According to our results, we propose that ideal adhesives should have an elastic modulus in the order of magnitude of the transverse elastic modulus of wood and should be able to penetrate not only into wood cavities but also into the wood cell wall. In this paper, past results are reviewed and perspectives for future research are discussed.