Inhomogenous composition microstructure has been studied in order to obtain flat temperature characteristics of capacitance satisfying X7R specification in the EIA (Electronic Industries Association) standard. SEM analysis revealed the structure within one grain consists of three parts: the core, the shell and in-between one. Temperature dependence of dielectric constant demonstrated that the shell and the in-between part contribute to dielectric characteristic at low and high temperature respectively.
展开▼
