首页> 外文会议>International Symposium for Testing and Failure Analysis >Advanced Package FA flow for next-gen packaging technology using EOTPR, 3DXRAY Plasma FIB
【24h】

Advanced Package FA flow for next-gen packaging technology using EOTPR, 3DXRAY Plasma FIB

机译:使用ETPR,3DXRAY和等离子FIB的下一代包装技术的高级包装FA流

获取原文
获取外文期刊封面目录资料

摘要

Within this paper, the authors present an adapted FA flow for state-of-the-art Package Failure Analysis for 20nm technology and below. As a key aspect, three methods (EOTPR, 3D Xray & PFIB) are introduced as the next-gen FA standard methods for emerging package technologies such as TSV, u-pillar bumping and stacked-die devices. By showing different types of daily Package FA requests, the paper compares & discusses important factors such as turn-around-time (TAT), success yield and results quality. In the end, an outlook is given how recent developments on these techniques will help to establish a new standard FA flow.
机译:在本文中,作者介绍了适用于20nm技术的最先进的包装故障分析的适应性FA流量。作为一个关键方面,三种方法(ETPR,3D XRAY和PFIB)被引入作为新兴封装技术的下一个Gen FA标准方法,例如TSV,U柱凸块和堆叠模具装置。通过显示不同类型的日常包裹请求,该论文比较并讨论了转弯时间(TAT),成功产量和结果质量等重要因素。最后,举行了一个前景,这些技术的最新发展有助于建立新的标准FA流。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号