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A Detailed Analysis Scheme to Interpret Multiple Photon Emissions Micrograph for Improved Diagnostic Resolution on Open Defects

机译:一种详细的分析方案,解释多重光子排放显微照片,以改善打开缺陷的诊断分辨率

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Photon Emission Microscopy is the most widely used mainstream defect isolation technique in failure analysis labs. It is easy to perform and has a fast turnaround time for results. However, interpreting a photon emission micrograph to postulate the suspected defect site accurately is challenging when there are multiple abnormal hotspots and driving nets involved. This is commonly encountered in dynamic emission micrographs that are caused by open defects in digital logic. This paper presents a methodology incorporating layout-aware trace analysis and post schematic extraction with test bench analysis to enhance the diagnostic resolution on the suspected defective net(s).
机译:光子发射显微镜是故障分析实验室中最广泛使用的主流缺陷隔离技术。它易于执行,并具有快速的周转时间进行结果。然而,在有多个异常热点和涉及的驾驶网时,将光子发射显微照片解释为假定疑似缺陷站点的假定是具有挑战性的。这通常遇到动态发射显微照片,这是由数字逻辑的开放缺陷引起的。本文介绍了一种掺入布局感知痕量分析的方法,并通过测试台分分析,提高疑似缺陷网的诊断分辨率。

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