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FUTURE SILICON SUBSTRATE FOR OPTO-ELECTRONIC COUPLED INTEGRATED CIRCUIT DEVICES

机译:用于光电耦合集成电路器件的未来硅衬底

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We propose a future silicon substrate for opto-electronic coupled integrated circuit devices in this article. The objective optical wavelength is short as around 300~400nm. The laser diodes around this wavelength are much required for future optical systems in our life. One of the most promising materials are GaN and its mixed alloys. The epitaxial growth of GaN on Si was carried out by using boron monophosphide (BP) as a buffer layer. First, the growth of BP on Si substrates has been carried out. We have successfully grown BP epitaxial layer on (100)Si substrates with l0Xl0mm~2 area. The GaN layer grown on BP/Si at around 800°C has been mainly cubic type. The growth of BP on Si and GaN on BP/Si will be discussed.
机译:我们在本文中提出了未来用于光电耦合集成电路器件的未来硅衬底。目标光波长短至约300〜400nm。在我们寿命中,未来的光学系统需要围绕该波长的激光二极管。最有前途的材料之一是GaN及其混合合金。通过使用硼单晶(BP)作为缓冲层进行GaN上的外延生长。首先,已经进行了对Si基材上的BP的生长。我们在具有L0XL0MM〜2区域的(100)Si基板上成功地增长了BP外延层。在800°C左右的BP / Si上生长的GaN层主要是立方式。将讨论BP / SI上SI和GAN上的BP的生长。

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