CHALLENGING OF 300mm VOLUME PRODUCTION

摘要

Major obstacles to the 21st century LSI manufacturing exist in economical issues as well as in technological ones. One solution for this complex problem is believed to be wafer diameter enlargement from 200mm to 300mm. Many chip suppliers are planning to bring their cutting-edge 300mm facilities in operation within a few years. In 1996, Japanese major LSI companies have established Selete (Semiconductor Leading Edge Technologies Inc.,) to deal with the chip production technologies using 300mm wafers and basic future technologies (technology computer aided design and advanced lithography). Selete has initially been focusing on evaluation of production equipment and materials for 300mm technology to accelerate their development since Nov.1996 using its own cleanroom. In this paper, discussion on the necessity and requirement of chip production using 300mm wafers, the latest development status of Selete, and forecast of 300mm related issues are presented.