首页> 外文会议>Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems >Thermal and Optical Characterization of White and Blue Multi-Chip LED Light Engines
【24h】

Thermal and Optical Characterization of White and Blue Multi-Chip LED Light Engines

机译:白色和蓝色多芯片LED灯发动机的热敏和光学特性

获取原文

摘要

A clear understanding of thermal characteristics for light emitting diodes (LEDs) is at the center of attention for lighting industry. Especially accurate evaluation of the junction temperature of various light engines is the subject matter for last two decades. Nonetheless, viability of the priorly offered solutions is still an argument and only a few of them are practical enough for the extensive practices. Therefore, in this research, utilization of a new multi-LED chip junction temperature measurement technique is studied through thermal characterization of a commercially available MR16 solid-state light lamp. In order to increase the precision of junction temperature measurement for complex LED structures, a newly proposed methodology is applied simultaneously for each LED chip and temperatures of the multi-LED system at each location are determined. Experimental analysis conducted using an advanced junction temperature measurement device that practices the inverse relationship between Forward Voltage (FV) and Junction Temperature (Tj) considering the three-dimensional heat flow from the p-n junction region. Validation of the above-stated measurement device is performed via local temperature maps captured by using an Infrared (IR) thermal camera and detailed CFD numerical models of each LED package is built with commercially available softwares. Optical measurements are then performed, and relevant thermo-optical relationships are established. Findings presented in this paper shown that augmented multi-chip junction temperature measurement method is a promising solution to measure temperature of complex multi-LED devices. In virtue of the established approach, thermal degradation and optical performance assessments of different types of light engines can be accomplished extensively. In future studies, junction temperature data gathered from various multi-LED light engines can be optimized to form a temperature predictive analytical models that can offer a new perspective for the advanced technological applications.
机译:清楚地了解发光二极管(LED)的热特性是照明工业的关注的中心。特别准确地评估各种灯发动机的结温是最近二十年的主题。尽管如此,先前提供的解决方案的可行性仍然是一个论点,而且只有少数人对广泛的做法来说是一种实用性。因此,在本研究中,通过商业上可获得的MR16固态光灯的热表征来研究新的多LED芯片结温测量技术的利用。为了提高复杂LED结构的结温测量的精度,确定每个LED芯片的新提出的方法,并确定每个位置处的多LED系统的温度。使用先进的结温测量装置进行的实验分析,其考虑来自P-N结区域的三维热流的正向电压(FV)和结温(TJ)之间的反向关系。通过使用红外线(IR)热摄像机捕获的局部温度映射来执行上述测量装置的验证,并且每个LED封装的详细CFD数值模型采用市售的软件。然后执行光学测量,并建立相关的热光学关系。本文提出的调查结果表明,增强多芯片结温测量方法是测量复杂多LED器件温度的有希望的解决方案。借助于建立的方法,可以广泛实现不同类型的光发动机的热降解和光学性能评估。在未来的研究中,可以优化从各种多LED灯发动机收集的结温数据以形成温度预测分析模型,可以为先进的技术应用提供新的视角。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号