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Grinding performances of directionally aligned SiC whisker wheel

机译:磨削定向对齐的SIC晶须轮的性能

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This paper examines the grinding performances of directionally aligned SiC whisker wheel. The effects of various parameters of wheel on the surface finish are clarified. The considered parameters related to the grinding wheel design were thesegment width, whisker diameter, additive and bonding material. The experimental results are as follows: (1) The smaller the diameter of whisker and the narrower the segment width, the better the surface finish. Moreover, the resin bonded wheel withchromium oxide additive has produced the best surface finish; (2) The ultra fine grinding chips and the finished surface have been observed and the finished surface was analyzed by laser interferometer and atomic force microscopes; (3) Surface finish with a roughness value of 1.5nmRa has been successfully obtained.
机译:本文研究了方向对齐的SIC晶须轮的研磨性能。阐明了轮子各种参数对表面光洁度的影响。与砂轮设计相关的考虑参数是螺旋宽度,晶须直径,添加剂和粘合材料。实验结果如下:(1)晶须的直径越小,区段宽度越窄,表面光洁度越好。另外,树脂键合轮氧化氧化物添加剂已产生最佳表面光洁度; (2)已经观察到超细研磨芯片和成品表面,并通过激光干涉仪和原子力显微镜分析成品表面; (3)成功地获得了粗糙度值1.5nmra的表面光洁度。

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