Grinding using directionally aligned SiC whisker wheel -anti-loading by addition of abrasive grains to grinding fluid-

摘要

A new grinding wheel has been developed, in which very fine SiC whiskers are normally aligned to the grinding surface. Using this printing wheel, a smooth surface of hardened die steel could be produced with the roughness of 16nmRmax (1.5nmRa). However, one problem was observed in the grinding process: the grinding wheel exhibits a high tendency to loading, and the grinding efficiency thus decreases. In this study, a method to improve the grinding efficiency was suggested.